Bonding Wire is a thin line to connect semiconductor chip and outer lead electrically, and a functional material composing the semiconductor. Heesung¡¯s Gold Bonding Wire, manufactured with Au with high purity of 99.999%, has been used in Korean semiconductor industry with its prominent features and perfect quality, and also acknowledged its quality by world market.
Heesung also suggests customer breaking through for continuously raised gold price developing low cost products like Cu, Pd coated Cu and Au-Ag alloy wire.
