| Element |
Usage |
Plating Process |
Concen
tration |
Preci
pitation efficiency |
Current Density |
Application & Features |
| Gold |
Pure gold |
TEMPEREX 8400
TEMPEREX 209A
TEMPEREX 9500
MICROFAB AU 660 |
8
4
8
16 |
110~120 |
0.2~1.0
0.1~0.5
0.2~1.0
0.5~1.2 |
Semiconductor COB,TAP
wafer BUMP |
| Alloy |
AUTRONEX GVC(Au/Co)
AUTRONEX GVC-L(Au/Co)
AUTRONEX NI(Au/Ni) |
8~18
4
8 |
20~30
10
30~40 |
10~150
0.5~10
0.3~1.5 |
CONNECTOR high speed electroplating |
| Electroless |
LECTROLESS Au
CERAGOLD 6070 |
- |
- |
- |
substitution/reducing
TYPE |
| STRIKE |
AUROBOND TN |
1 |
- |
1~8 |
Adhesive capacity elevation between material and gold plating |
| Silver |
|
SILVERX II |
80
24
3 |
63~67
67
67 |
1~5
1~2
1.5 |
gloss, pure silver plating solution, esp., connector, printer, wiring device |
| Palladium |
|
PALLADEX LF4 |
3 |
28~33 |
0.25~1.0 |
Electronic components Semiconductor CONNECTOR |
| Rhodium |
|
RHODEX
BRIGHT RHODIUM
SUPERRHODIUM
NO.1 SUPER WHITE |
5
2
5
1 |
18
2~5
15
5 |
1.3
2.0
1.3
2.0 |
Industry, Ornament, esp., RHODEX is for lead switch |
| Platinum |
|
PLATANEX 18 LS
PLATANEX SF
PLATINART 100 |
12
20
2 |
15~20
28~30
28~30 |
20
1~3
1~3 |
Plating solution |
| Ruthenium |
|
RUTHENEX |
10 |
10 |
1.0 |
high hardness, good corrosion resistance |
| Indium |
|
INDEX |
30 |
22 |
30 |
Non-gloss, highly-pure plating solution |
