 |
 |
 |
| - Pb free - Ni/P PROCESS optimized PROCESS |
| Good soldering features (joint strength, Solder wetting) |
| Continuously usable for long time |
| Applicable to thin plating or thick plating |
|
 |
Feature ¡¬ Plating
Solution |
LECTROLESS 1210 |
LECTROLESS AU1300 |
| Precipitation velocity (%) |
99.9+ |
99.9+ |
| Au amount (g/L) |
1.5 |
2 |
| Type |
weak acid |
weak acid |
| Humidity(¡É) |
75-85 |
75-90 |
| Precipitation efficiency (mg/§£®§¯) |
1.90-1.93 |
1.90-1.93 |
|
 |
 |
| - Pb free environmental PROCESS corresponding to RoHS |
| Wire Bondin capacity, heat resistance, Solder wetting capacity |
| High speed precipitation to give excellent productivity |
| Easily manageable for solution owing to the analyzing possibility of valid contents |
|
 |
| |
Existing TI |
CG6060 |
CG6070 |
| Morphology |
lemon |
lemon |
lemon |
| TI concentration |
9ppm |
2ppm |
2ppm |
| Precipitation velocity |
3~5§/hr. |
4~6§/hr. |
3~5§/hr. |
| TIporosity |
151ppm |
35ppm |
35ppm |
|
 |
